Radiator

ABSTRACT

A radiator includes a fan, a heat pipe, and a heat-dissipation fin arranged on the heat pipe. The heat pipe is perpendicularly inserted in a first hole of the heat-dissipation fin. The heat-dissipation fin is provided with a second hole for heat dissipation. A flow-guide assembly, including a first sheet, a second sheet and a third sheet, is arranged at the second hole. The first and second sheets are provided at two opposite ends of the second hole, respectively, and extend out of the heat-dissipation fin. The third sheet is inclinedly connected between the first and second sheets, and has a side abutting a side of the second hole. During operation, air is blown by the fan to the heat-dissipation fin, and the air flow partially flows out through the second hole to form a return flow, prolonging the time for airflow to pass through the heat-dissipation fin.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority from Chinese PatentApplication No. 202321571516.2, filed on Jun. 19, 2023. The content ofthe aforementioned application, including any intervening amendmentsmade thereto, is incorporated herein by reference in its entirety.

TECHNICAL FIELD

This application relates to heat dissipation, in particular to aradiator.

BACKGROUND

Enhanced performance, high integration and high density of computers andother electronic devices result in increasing-growing power consumption.The continuous operation of electronic devices will produce a lot ofheat, and if the heat cannot be dissipated in time, it will lead tooverheating of devices and affect their performance, or even damage theelectronic devices. Therefore, considerable attention has been paid tothe heat dissipation in the design of electronic devices.

In the prior art, the fin size of the air-cooling radiator is limited bythe computer case and motherboard, and thus cannot be increased. In thiscase, the power consumption is limited. Besides, the current air-coolingradiators have no air channels at the fins, and therefore the air flowgenerated by fan will flow through the fins in a short period of time,resulting in less heat dissipation and poor cooling efficiency. In viewof this, it is urgently needed to further enhance the cooling efficiencyof air-cooling radiators.

SUMMARY

An object of this application is to provide a radiator to overcome theshortcomings of the prior art.

Technical solutions of the present disclosure are described as follows.

This application provides a radiator, comprising:

-   -   a fan;    -   a heat pipe; and    -   a heat-dissipation fin arranged on the heat pipe;    -   wherein the heat pipe is perpendicularly inserted into a first        hole of the heat-dissipation fin; the heat-dissipation fin is        further provided with a second hole for heat dissipation; a flow        guide assembly is provided at the second hole; the flow guide        assembly comprises a first sheet, a second sheet and a third        sheet; the first sheet and the second sheet are provided at two        opposite ends of the second hole, respectively; the first sheet        and the second sheet are configured to extend out of a top        surface of the heat-dissipation fin; the third sheet is        inclinedly connected between the first sheet and the second        sheet; and a side of the third sheet abuts a side of the second        hole.

The fan can accelerate the air flow to lower the temperature of theheat-dissipation fin faster, so as to promote the heat dissipation ofthe heat pipe. An inside of the heat pipe is sealed. Theheat-dissipation fin is an aluminum plate or a copper plate. Theperpendicular insertion has a stable fitting effect, and theheat-conduction effect is good. The arrangement of the heat-dissipationhole introduces air channels to the heat-dissipation fin and optimizesthe boundary layer. The open-type flow guide assembly protruding fromthe heat-dissipation fin provides a transverse opening to form an airchannel to control the air flow. During operation, a laminar flowstructure can be generated when the air flow generated by the fan flowsthrough the heat-dissipation fin, which extends the time for the airflow to pass through the heat-dissipation fin, so as to take more heataway and improve the cooling efficiency of the radiator.

In one embodiment, the number of the second hole is 24, and the 24second holes are divided into four groups with 6 holes in each group;the 6 holes in each group are distributed in a 2 (row)×3 (column) array.The four groups of second holes are symmetrically distributed in anarray at four corners of the heat-dissipation fin along the X-axisdirection and Y-axis direction.

In one embodiment, the number of the second hole is 24, and the 24second holes are divided into four groups with 6 holes in each group;the 6 holes in each group are distributed in a 2 (row)×3 (column) array.The second holes are symmetrically distributed at the four corners ofthe heat-dissipation fin in a staggered manner, and the four groups ofsecond holes are symmetrically distributed along the X-axis directionand Y-axis direction. The staggered arrangement can prevent air flows ofthe second holes from interfering with each other, making the wind flowsmoother.

In one embodiment, an angle between the third sheet and a top surface ofthe heat-dissipation fin is 20-30 degrees. The angle of 20-30 degreescan not only facilitate the formation of the air channel, but also avoidthe flow guide assembly from excessively protruding from theheat-dissipation fin.

In one embodiment, an opening of the flow guide assembly faces towardsoutside of the heat-dissipation fin, which facilitates the heat removal.

In one embodiment, at least two heat-dissipation fins are stacked on theheat pipe; and a spacing between adjacent heat-dissipation fins islarger than a height of the highest point of the flow guide assembly,which will not affect the height of the radiator and facilitate theadaption to the existing devices.

In one embodiment, a fixing base is arranged at a bottom of the heatpipe, and additional accessories, such as fan, can be fixed on thefixing base. The fixing base is made of aluminum because of its low costand good plasticity. The fixing base has a T-shaped structure. Each sideof the fixing base is provided with a screw hole for fixing otheraccessories.

In one embodiment, a bottom surface of the fixing base is provided withat least one first groove, and which is in close and parallelarrangement. The number of the at least one first groove is more than orequal to the number of the heat pipe, so that every heat pipe has afitting position and can be held, and the number of heat pipes can beadjusted according to demand. The top surface of the fixing base isprovided with at least one second groove, which is in a close andparallel arrangement. The second grooves can further promote the fixingin cooperation with additional accessories.

In one embodiment, a heat conduction base is provided at the bottom ofthe heat pipe. The heat conduction base is in direct contact with theheat source, which can transfer heat to the heat pipes quickly. The heatconduction base is provided with at least one groove, which is in closeand parallel arrangement on the upper surface of the heat conductionbase. The number of the groove is more than or equal to the number ofthe heat pipe, so that every heat pipe has a fitting position can beheld, and the number of heat pipes can be adjusted according to demand.

In one embodiment, the heat conduction base is made of copper, which hashigh heat conductivity coefficient and excellent heat conductionperformance.

The benefits of this application are described as follows.

This application improves the heat dissipation efficiency of the fin ofthe air-cooling radiator with the fin size remaining unchanged. It alsointroduces the design of air channels and optimizes the boundary layerby arranging the heat-dissipation holes. When the radiator is working,the time for the air flow generated by the fan to pass through theheat-dissipation fin is increased so as to take more heat away andimprove the cooling efficiency. Therefore, the radiator provided hereincan effectively dissipate the heat generated by the electronic devicesand facilitate keeping the output power and performance of electronicdevices stable, exhibiting a brilliant application prospect.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to illustrate the technical solutions of this application moreclearly, the accompanying drawings required in the description ofembodiments will be briefly introduced below. It should be understoodthat the following accompanying drawings only show some embodiments ofthis application, and therefore should not be considered as alimitation. For those of ordinary skill in the art, other relevantaccompanying drawings can also be obtained according to these drawingswithout making creative effort.

FIG. 1 is an exploded view of a radiator according to an embodiment ofthis application.

FIG. 2 is a front view of the radiator according to an embodiment ofthis application.

FIG. 3 is a side view of the radiator according to an embodiment of thisapplication.

FIG. 4 is an enlarged view of portion “A” in FIG. 3 .

FIG. 5 is a top view of the radiator according to an embodiment of thisapplication.

FIG. 6 is a bottom view of the radiator according to an embodiment ofthis application.

FIG. 7 is a front view of a heat-dissipation fin of the radiatoraccording to an embodiment of this application.

FIG. 8 is a top view of the heat-dissipation fin according to anembodiment of this application.

FIG. 9 is a side view of the heat-dissipation fin according to anembodiment of this application.

FIG. 10 is a perspective view of the heat-dissipation fin according toan embodiment of this application.

FIG. 11 structurally shows a fixing base of the radiator according to anembodiment of this application.

FIG. 12 structurally shows a heat conduction base of the radiatoraccording to an embodiment of this application.

FIG. 13 is an enlarged view of portion “B” in FIG. 10 .

In the drawings: 1, heat-dissipation fin; 2, heat pipe; 3, heatconduction base; 4, fixing base; 11, heat-dissipation hole; 12, thirdsheet; 13, top surface of heat-dissipation fin; 31, first groove; 41,screw hole; 42, second groove; and 43, third groove.

DETAILED DESCRIPTION OF EMBODIMENTS

The present disclosure will be further described below with reference toaccompanying drawings and embodiments to facilitate understanding of thedisclosure. Presented in the drawings are merely some embodiments of thedisclosure. The embodiments provided herein are intended to facilitatethe understanding of the technical contents of the disclosure, ratherthan limiting the disclosure.

It should be noted that, when a component is said to be “fixed”(“connected”) to another component, it can be directly fixed (connected)to another component or directly fixed (connected) to another componentwith an intermediate component. The terms, such as “perpendicular”,“horizontal”, “left”, “right” and other similar expressions used hereinare only illustrative, and are not intended to limit the implementation.

Unless otherwise defined, all technical and scientific terms used hereinhave the same meaning as commonly understood by those skilled in theart. These terms used herein are only descriptive, and are not intendedto limit the application. The term “and/or” used herein includes any andall combinations of one or more relevant listed items.

Referring to an embodiment of this application shown in FIGS. 1-13 , aradiator includes a fan, at least one heat pipe 2, and at least oneheat-dissipation fin 1 arranged on the heat pipe 2. The heat pipe 2 isperpendicularly inserted in a hole of the heat-dissipation fin 1. Theheat-dissipation fin 1 is provided with at least one heat-dissipationhole 11. A flow guide assembly is provided at the heat-dissipation hole11, and includes a first sheet, a second sheet and a third sheet 12. Thefirst sheet and the second sheet are provided at two opposite ends ofthe heat-dissipation hole 11, respectively. The first sheet and thesecond sheet are configured to extend out of a top surface of theheat-dissipation fin 1. The third sheet 12 is inclinedly connectedbetween the first sheet and the second sheet, and a side of the thirdsheet 12 abuts a side of the heat-dissipation hole 11.

The fan can accelerate the air flow so as to reduce the temperature ofthe heat-dissipation fin 1 faster and dissipate heat generated by theheat pipe 2 faster. The heat-dissipation fin 1 arranged on the heat pipe2 is a copper plate or an aluminum plate. The perpendicular insertion ofthe heat pipe 2 in the heat-dissipation fin 1 realizes firm and fittingconnection and has good heat conduction effect. The heat-dissipationhole 11 arranged on the heat-dissipation fin 1 can increase the numberof air channels and optimize the boundary layer. During operation, alaminar flow structure will be created when the air flow generated bythe fan passes through the heat-dissipation fin 1. The flow guideassembly can offer a transverse opening. A part of the air flowgenerated by the fan will flow back through the heat-dissipation hole 11and the flow guide assembly to create a swirl flow, thereby prolongingthe time for the air flow to pass through the heat-dissipation fin 1 andtaking away more heat. The heat dissipation efficiency of the radiatoris improved with the size of the heat-dissipation fin 1 remainingunchanged.

In an embodiment, the heat-dissipation fin 1 has 24 heat-dissipationholes 11, which are symmetrically distributed in an array at fourcorners of the heat-dissipation fin 1.

The 24 heat dissipation holes 11 are divided into four groups with 6holes in each group, and the 6 heat-dissipation holes in each group aredistributed in a 2 (row)×3 (column) array. The four groups of heatdissipation holes 11 are symmetrically distributed at four corners ofthe heat-dissipation fin 1 along the X-axis direction and Y-axisdirection.

In an embodiment, the heat-dissipation fin 1 has 24 heat-dissipationholes 11, which are symmetrically distributed at four corners of theheat-dissipation fin 1 in a staggered manner.

The 24 heat-dissipation holes 11 are divided into four groups with 6holes in each group, and the 6 holes in each group are distributed in a2 (row)×3 (column) array. The four groups of heat-dissipation holes 11are symmetrically distributed at four corners of the heat-dissipationfin 1 in a staggered manner along the X-axis direction and Y-axisdirection. The staggered arrangement can prevent air flows of theheat-dissipation holes from interfering with each other, making the windflow smoother.

In an embodiment, an angle between the third sheet 12 and the topsurface 13 of the heat-dissipation fin 13 is 20-30 degrees.

The angle of 20-30 degrees can not only facilitate the formation of airchannels to control the air flow, but also avoid the flow guide assemblyfrom excessively protruding from the heat-dissipation fin 1, such thatit is compatible with the existing heat-dissipation fins.

In an embodiment, an opening of the flow guide assembly faces towardsoutside of the heat-dissipation fin 1.

By adopting the technical solution above, the flow guide assembly canswirl the air flow passing therethrough, extending the time for the airflow to pass through the heat-dissipation fin 1 and taking away moreheat.

In an embodiment, at least two heat-dissipation fins 1 are stacked onthe heat pipe 2. A spacing between adjacent two heat-dissipation fins 1is larger than a height of the highest point of the flow guide assembly.

By adopting the technical solution above, the heat-dissipation fins 1can be stacked according to the existing specification, and the spacingbetween adjacent two heat-dissipation fins 1 is larger than a height ofthe highest point of the flow guide assembly, which can not affect theheight of the existing radiators and adapt to the existing devicesbetter.

In an embodiment, a fixing base 4 is arranged on the bottom of the heatpipe 2, and is made of aluminum. The fixing base 4 has a T-shapedstructure. Each side of the fixing base 4 is provided with a screw hole41.

By adopting the technical scheme above, additional accessories, such asfan and light strip, can be fixed on the fixing base 4. The fixing base4 is made of aluminum for its lower cost and good plasticity. The fixingbase 4 has a T-shaped structure and easy to mount. The screw hole 41 canfacilitate the fixing.

In an embodiment, the bottom surface of the fixing base 4 is providedwith at least one first groove 42. The number of the first groove 42 ismore than or equal to the number of the heat pipe 2. The top surface ofthe fixing base 4 is provided with at least one second groove 43.

By adopting the technical solution above, multiple first grooves 42 arearranged closely in parallel on the bottom surface of the fixing base 4.The number of the first grooves 42 is more than or equal to the numberof the heat pipes 2 such that every heat pipe 2 can be held, and thenumber of the heat pipes 2 can be adjusted according the demand. Themultiple second grooves 43 are arranged closely in parallel on the topsurface of the fixing base 4. The second grooves 43 can be used withadditional accessories to achieve the fixing functions.

In an embodiment, a heat conduction base 3 is arranged at the bottom ofthe heat pipes 2. The heat conduction base 3 is provided with at leastone third groove 31. The number of the third grooves 31 is more than orequal to the number of the heat pipes 2.

By adopting the technical scheme above, the heat conduction base 3 underthe bottom of the heat pipes 2 is in direct contact with the heatsource, and can quickly transfer heat to the heat pipes 2. The topsurface of the heat conduction base has multiple third grooves 31, whichare arranged closely in parallel. The number of the third grooves 31 ismore than or equal to the number of the heat pipes 2 so that every heatpipe 2 has a fitting and holding position, and the number of the heatpipes 2 can be adjusted according to demand.

In an embodiment, the heat conduction base 3 is made of copper.

By adopting the technical scheme above, the heat conduction base 3 takesadvantage of the high heat conductivity coefficient of copper to achievethe great heat conduction effect.

The working principle is described as follows. The arrangement ofheat-dissipation holes 11 on the heat-dissipation fin 1 can introduceair channels for the heat-dissipation fin 1 and optimize the boundarylayer. During operation, the air flow is blown by the fan towards theheat-dissipation fin 1, and a part of the air flow flows out through theheat-dissipation hole 11 and the flow guide assembly to form a returnflow, which prolongs the time for the flow to pass through theheat-dissipation fin 1 so as to take away more heat, thereby improvingthe cooling efficiency and heat dissipation efficiency of the radiatorwith the size of the fin remaining unchanged.

In the practical application, the heat conduction base 3 is installed onthe heat-generating spot, and the fan or light strip can be additionallyfixed on the fixing base 4.

Described above are only several embodiments of the disclosure, and arenot intended to limit the disclosure. It should be pointed out thatvarious variations and improvements made by those of ordinary skill inthe art without departing from the spirit of the disclosure shall alsofall within the scope of the disclosure defined by the appended claims.

What is claimed is:
 1. A radiator, comprising: a fan; a heat pipe; and aheat-dissipation fin arranged on the heat pipe; wherein the heat pipe isperpendicularly inserted into a first hole of the heat-dissipation fin;the heat-dissipation fin is further provided with a second hole for heatdissipation; a flow guide assembly is provided at the second hole; theflow guide assembly comprises a first sheet, a second sheet and a thirdsheet; the first sheet and the second sheet are provided at two oppositeends of the second hole, respectively; the first sheet and the secondsheet are configured to extend out of a top surface of theheat-dissipation fin; the third sheet is inclinedly connected betweenthe first sheet and the second sheet; and a side of the third sheetabuts a side of the second hole.
 2. The radiator of claim 1, wherein thenumber of the second hole is 24, and 24 second holes are symmetricallydistributed in an array at four corners of the heat-dissipation fin. 3.The radiator of claim 1, wherein the number of the second hole is 24,and 24 second holes are symmetrically distributed at four corners of theheat-dissipation fin in a staggered manner.
 4. The radiator of claim 1,wherein an included angle between the third sheet and the top surface ofthe heat-dissipation fin is 20-30 degrees.
 5. The radiator of claim 1,wherein an opening of the flow guide assembly faces towards outside ofthe heat-dissipation fin.
 6. The radiator of claim 1, wherein the numberof the heat-dissipation fin is at least two; at least twoheat-dissipation fins are stacked on the heat pipe; and a spacingbetween adjacent two heat-dissipation fins is larger than a height of ahighest point of the flow guide assembly.
 7. The radiator of claim 1,wherein a fixing base is arranged at a bottom of the heat pipe; thefixing base is made of aluminum, and has a T-shaped structure; and eachside of the fixing base is provided with a screw hole.
 8. The radiatorof claim 7, wherein a bottom surface of the fixing base is provided withat least one first groove; the number of the at least one first grooveis more than or equal to the number of the heat pipe; the at least onefirst groove fits the heat pipe; and a top surface of the fixing base isprovided with at least one second groove.
 9. The radiator of claim 1,wherein a heat conduction base is arranged on a bottom of the heat pipe,and the heat conduction base is provided with at least one groove; theat least one groove fits the heat pipe; and the number of the groove ismore than or equal to the number of the heat pipe.
 10. The radiator ofclaim 9, wherein the heat conduction base is made of copper.